ELECTRONICS DIVISION
We provide optimum solutions to customers’ needs making full use of our embedded CPU development technologies, camera development technologies, control panel system development technologies and board mounting technologies.
We provide optimum solutions to customers’ needs making full use of our embedded CPU development technologies, camera development technologies, control panel system development technologies and board mounting technologies.
TECHNOLOGY
HARDWARE TECNOLOGY
HARDWARE TECNOLOGY
- Embedded computer systems (CompactPCI, PCI, CardBus, ISA)
- Technologies for microcomputer application systems
- Serial/parallel communication technologies (Ethernet, USB, GPIB)
- High-speed, digital, logic PCB mounting/wiring technologies
- CE control technologies for devices
- Device design/mass production technologies
SOFTWARE TECNOLOGY
SOFTWARE TECNOLOGY
- Application software development technologies
- Embedded software development technologies
- Embedded OS technologies (XP Embedded, CE, Linux)
- Machine control technologies
TOTAL SOLUTIONS
These “six cubes” underlies “HINO’s total solutions” with our corporate philosophy of “providing
solutions guaranteeing customers’ best satisfaction.”
Under the turbulent market environment, we properly capture an increasingly
wide range of customers’ needs, and make use of these six elements to provide
optimum total solutions.
- TOTAL TECHNOLOGICAL STRENGTH
- Collaboration with universities, research institutions, and companies
- ADVANCED TECHNOLOGICAL APPLICATION
- Make use of latest advanced technologies in various fields
- ISO9001:2000
- Technologies with consistently high quality from development to manufacture
- LIFE CYCLE SUPPORT
- Contribute to improvements in price over system life cycles
- CUSTOMIZED COMPUTERS
- Establish optimum systems with various partners
- PROJECT MANAGEMENT
- Guarantee reliability of quality, costs, delivery dates, etc.
NETWORK
Collaboration with Universities
- Member of Nihon University Business, Research and Intellectual Property Center (NUBIC)
- Member of NPO FINE (Tokyo Metropolitan University)
[Universities]
Nihon University, University of Tsukuba, Tokyo Metropolitan University (Tokyo Metropolitan University, Tokyo Metropolitan Institute of Technology), Meiji University, Kogakuin University
- Orgabization
- Member of UAC-NET, Shinfuji Cooperative Society
- Member of ACT 30, Cross-Industrial Exchange Group, Tokyo Metropolitan Small and Medium Enterprise Support Center
- Member of Greater Tokyo Initiative (Technology Advanced Metropolitan Area)
- B-member of T-Engine Project
EMS
EMS (Electronics Manufacturing Service) is a service by which Hino Engineering manufactures part or all of a manufacturer's products.
Leave everything up to us, from procurement of materials to assembly, wiring and testing after mounting.
HEAD OFFICE FACTRY
BOARD MOUNTING (Introduction of equipment)
| Solder Paste Softener |
Solder Paste Printer |
SMT Chip Mounter |
SMT Odd-shaped Component Chip Mounter |
|---|---|---|---|
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| N2 Reflow Equipment | Visual Inspection | X-ray Inspection Apparatus |
Flow Solder Bath (Lead-free solder) |
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ASSEMBLING/WIRING
We provide high-quality assembly and wiring based on our long years of experience and high level of technology. Please entrust to us from delivery of parts such as housings and harnesses, wiring and assembly, to final stages of production
ADJUSTMENT/TEST, MAINTENANCE
Products are subjected to pre-delivery adjustment and inspection, and maintenance such as modification, repairing, and inspection. We will respond accurately and quickly making use of our achievements and experience in analysis, etc.
SUN FIELD VIETNAM CO.,LTD
We established our own plant “SUN FIELD VIETNAM CO., LTD.” in Vietnam-Singapore
Industrial Park (VSIP) in Ho Chi Minh City, Vietnam in 2009. A great deal
of processing and manufacture have been taken place.
VSIP is located in BinhDuong Province at about 17 km from Ho Chi Minh City,
and readily accessible from Tan Son Nhat International Airport and Harbor.
VSIP is an industrial park with a good environment having its own power
supply and well-developed infrastructures such as electricity, transport,
living and communication.
We can offer low-cost and high-quality products with our plant for manufacture
of plastic molded parts, board mounting lines and parts assembly and with
young manpower in Vietnam and reliable techniques from Japan.
Tie-up between our Head Office and Vietnam Plant allows “consistent services
from design to manufacture” and parts procurement for every project of
HINO Engineering Group.
Regarding product shipment, we can provide support for not only FOB but
also CIF, and there is no need to worry about quality risk due to transportation.
We established our own plant “SUN FIELD VIETNAM CO., LTD.” in Vietnam-Singapore Industrial Park (VSIP) in Ho Chi Minh City, Vietnam in 2009. A great deal of processing and manufacture have been taken place.VSIP is located in BinhDuong Province at about 17 km from Ho Chi Minh City, and readily accessible from Tan Son Nhat International Airport and Harbor. VSIP is an industrial park with a good environment having its own power supply and well-developed infrastructures such as electricity, transport, living and communication.We can offer low-cost and high-quality products with our plant for manufacture of plastic molded parts, board mounting lines and parts assembly and with young manpower in Vietnam and reliable techniques from Japan.Tie-up between our Head Office and Vietnam Plant allows “consistent services from design to manufacture” and parts procurement for every project of HINO Engineering Group.Regarding product shipment, we can provide support for not only FOB but also CIF, and there is no need to worry about quality risk due to transportation.
ASSEMBLY
ASSEMBLY
We can offer low-cost and high-quality products with young manpower in at our Vietnam Plant and reliable techniques from Japan.
We can offer low-cost and high-quality products with young manpower in at our Vietnam Plant and reliable techniques from Japan.
“MultiFlex®”, Hino Engineering's original brand, is a series of computer boards, camera modules and IoT communication modules specifically for industrial embedded devices.
All products in the “MultiFlex®” series can be customized according to the customer's specifications. We offer high quality products with long-lasting reliability.
“MultiFlex®”, Hino Engineering's original brand, is a series of computer boards, camera modules and IoT communication modules specifically for industrial embedded devices.
All products in the “MultiFlex®” series can be customized according to the customer's specifications. We offer high quality products with long-lasting reliability.
COMPUTERS
HINO Engineering is a professional group of experts in customizing industrial
computers and pursuing “quick, careful and reliable” services. We not only
sell CPU boards but can also offer embedded system development and end
system development.
Our CPU boards are made in Japan and have a reputation for their quality.
Multi Flex CPU board
MultiFlex-A9
- LINEUP
- i.MX6Quad(1GHz) / i.MX6Dual(1GHz) / i.MX6Solo(800MHz)
- NAND FLASH
- 4GB(MAX16GB）
- MEMORY
- 2GB DDR3-1066(Quad・Dual) / 1GB DDR3-1066(Solo)
MultiFlex-ULL
- CPU
- i.MX6ＵＬＬ(528MHz)
- NAND FLASH
- 8GB
- MEMORY
- 512MB DDR3-1066
Multi Flex Carrier Board
We provide carrier boards on which our CPU boards can be mounted. Carrier boards include connectors such as interface connectors, sockets for CPU boards, and are optimum for communication evaluation, debug test, and operational suitability test.
DATASHEET
| Type | MultiFlex-A9 | MultiFlex-ULL | ||
|---|---|---|---|---|
| CPU | i.MX6Quad 1GHz | i.MX6Dual 1GHz | i.MX6Solo 800MHz | i.MX6ULL 528MHz |
| Memory | 2GB DDR3-1066(512MB×4) | 1GB DDR3-1066(512MB×2) | 512MB DDR3-1066(512MB×1) | |
| Graphics | HDMI×1・DRGB(8bit)×1・LVDS×2 | DRGB(8bit)×1 | ||
| NAND Flash | 4GB(max16GB) | 8GB | ||
| LAN | 10/100/1GBase×1 | 10/100Base×1 | ||
| PCI-Express | ×1(Gen2) | - | ||
| CAMERA | CSI×1 8bit IN（max20bit） | CSI×1 8bit IN | ||
| GPIO | 8bit(3.3V) / 1bit(1.8V) | 13bit | ||
| SD | 2slot | |||
| SATAⅡ | ×1(3Gbps) | - | ||
| USB | ×2(HOST+OTG) | |||
| UART | ×2 | ×5 | ||
| I2C | ×1 (MAX4) | ×1 | ||
| SPI | ×3 | ×1 | ||
| Debug | JTAG,UART | UART | ||
| STACKCONNECTER | ×2 | ×1 | ||
| BOARD SIZE | 90.0(W)×55.0(D)mm | 72.0(W)×50.0(D)mm | ||
| POWER | DC4.2V,3.3V | DC5V | ||
CUSTOMIZE
| MINI BOX PC | DIGITAL SIGNAGE | PANELMOUNT COMPUTER | TABLE COMPUTER |
|---|---|---|---|
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MultiFlex-PPC-
RT1050
Performance
Start
・High performance Pnanel PC
・Real time OS
・Power saving / Smooth operation
・For control panels need instant startup
| Data Sheet | |||
| Model number | MultiFlex-PPC-RT1050 | ||
| CPU Performance | CPU | NXP® i.MX-RT1050 | |
| Arm® Cortex-M7 | |||
| Real-time processing | |||
| Frequency | 528MHz（Industrial） | ||
| Memory | SRAM 512 KB | ||
| Interface | LAN | ×1 * It has a unique shape, so it connects to the internet. In that case, another conversion board is required. |
|
| USB | USB2.0 Type-A connector×2 | ||
| SD card slot | MicroSDHC card slot×1 | ||
| LCD | CMOS parallel Resolution：MAX WXGA（1366×768） |
||
| Others | UART×2 | ||
| I2C×1 | |||
| SPI ×2（When not using the SD slot） ｘ1（When using SD slot） |
|||
| GPIO×11 | |||
| External dimensions (board size) | 106×68mm | ||
| Input voltage | DC5Ｖ | ||
| Power consumption | About 150mW | ||
| Operating temperature | ‐30℃～70℃ | ||
CAMERAS
HINO Engineering started camera business.
We sell a line-up mainly including industrial cameras and provide custom
development.
Multi Flex-CAM-1080 series
MultiFlex-CAM-
1080E
Performance
・Flexible Full HD for the application
・Full HD camera module
・Compact, low cost, MIPI output
・For facial recognition, embedded devices, and hobbies etc.
| Data Sheet | |||
| Model | MIPI 2M camera module | ||
| Model number | MultiFlex-CAM-1080E-A | MultiFlex-CAM-1080E | |
| Model number configuration | (-A): IR cut lens | Blank: No IR cut lens | |
| MultiFlex-CAM-1080E-※※※※(-A) | |||
| ※※※※ → 4-digit lens model number (for lenses other than the following) | |||
| Number of pixels | 1920 x 1080 (Full HD, approx. 2 million pixels) | ||
| Optical part | Lens | S-mount (M12, 0.5mm pitch) non-adhesive (replaceable) | |
| Aperture/focal length | F2.5±5% 2.5mm | ||
| Angle of view | H: 120° / V: 69° / D: 137° | ||
| IR cut filter | Yes | None | |
| Image sensor part | Image sensor | Galaxy Core GC2053 | |
| Optical size | 1/2.9 inch | ||
| Shutter method | Rolling shutter | ||
| Coding | RGB bayer pattern | ||
| Frame rate | 30fps | ||
| Image signal processor | Model number | X-CHIP XC7022 | |
| Feature | AE (exposure control) and AWB (automatic white balance) | ||
| Mirroring etc. | |||
| Interface | Format | YUV422 | |
| Output method | MIPI | ||
| Compression method | Uncompressed | ||
| Output connector | Amphenol ICC SFW15R-1STE1LF (15 pin) | ||
| Debug connector | JST BM04B-SRSS (4 pin) | ||
| External size | 30×30mm | ||
| Mounting pitch | 25×25mm φ2.2×4 | ||
| Operating temperature | TBD (non-condensing) | ||
| Storage temperature | TBD (non-condensing) | ||
| Weight (excluding lens cap) | 12g (excluding lens cap) | ||
| Power consumption | TBD | ||
| Input voltage | DC3.3V±0.3V | ||
| Waterproof/Dustproof | none | ||
| Environmental regulations | RoHS2 compliant (TBC) | ||
MultiFlex-CAM-
1080H
Performance
・Flexible Full HD for the application
・Full HD camera module
・WDR feature and MIPI output, able to shooting in various environments
・For surveillance cameras and Dash cam etc.
| Data Sheet | |||
| Model | WDR MIPI 2M Camera Module | ||
| Model number | MultiFlex-CAM-1080H-A | MultiFlex-CAM-1080H | |
| Model number configuration | (-A): IR cut lens | Blank: No IR cut lens | |
| MultiFlex-CAM-1080H-※※※※(-A) | |||
| ※※※※ → 4-digit lens model number (for lenses other than the following) | |||
| Number of pixels | 1920 x 1080 (Full HD, approx. 2 million pixels) | ||
| Optical part | Lens | S-mount (M12, 0.5mm pitch) non-adhesive (replaceable) | |
| Aperture/focal length | F2.5±5% 2.5mm | ||
| Angle of view | H: 124.4° / V: 72° / D: 141° | ||
| IR cut filter | Yes | None | |
| Image sensor part | Image sensor | ON Semiconductor AR0230 | |
| Optical size | 1/2.7 inch | ||
| Shutter method | Rolling shutter | ||
| Coding | RGB bayer pattern | ||
| Frame rate | 30fps | ||
| Image signal processor | Model number | X-CHIP XC7022 | |
| Feature | AE/AWB | ||
| Wide Dynamic Range | |||
| Mirroring etc. | |||
| Interface | Format | YUV422 | |
| Output method | MIPI | ||
| Compression method | Uncompressed | ||
| Output connector | Amphenol ICC SFW15R-1STE1LF (15 pin) | ||
| Debug connector | JST BM04B-SRSS (4 pin) | ||
| External size | 30×30mm | ||
| Mounting pitch | 25×25mm φ2.2×4 | ||
| Operating temperature | TBD (non-condensing) | ||
| Storage temperature | TBD (non-condensing) | ||
| Weight (excluding lens cap) | 12g (excluding lens cap) | ||
| Power consumption | TBD | ||
| Input voltage | DC3.3V±0.3V | ||
| Waterproof/Dustproof | none | ||
| Environmental regulations | RoHS2 compliant (TBC) | ||
MF-CAM-
1080WDRUSB35
Performance
・M8, M12 ( S-mount) holder selectable
・For places with intense light and dark
・USB out put
・For security camera, AI/ Image recognition etc.
| Data Sheet | ||
| Model | WDR USB 2M camera module | |
| Model number | MF-CAM-1080WDRUSB35 | |
| MF-CAM-1080WDRUSB35-※※※※ | ||
| ※※※※ → 4-digit lens model number (for lenses other than the following) | ||
| Number of pixels | 1920 x 1080 (Full HD, approx. 2 million pixels) | |
| Optical part | Lens | S-mount (M12, 0.5mm pitch) or M8ｘ0.35mm ptich |
| Aperture/focal length | Depends on the lens installed*1 | |
| Angle of view | Depends on the lens installed*1 | |
| IR cut filter | Yes | |
| Optical size | 1/2.9 inch | |
| Shutter method | Rolling shutter | |
| Coding | RGB bayer pattern | |
| Frame rate | 30fps | |
| ISP(Image Signal Processor) | Yes | |
| Feature | AE (exposure control) and AWB (automatic white balance) | |
| Wide Dynamic Range,Mirroring,Rotation etc. | ||
| Interface | Format | YUV422 |
| Output method | USB 2.0 UVC(USB Video Class)/ UART (Semi-custom) | |
| Compression method | H.264/MJPEG | |
| Output connector | USB Micro B | |
| Debug connector | JST BM04B-SRSS (4pin) | |
| External size | 35x35mm | |
| Mounting pitch | 30x30mm φ2.2×4 | |
| Operating temperature | 0℃～60℃ | |
| Storage temperature | -20℃～85℃ | |
| Weight (excluding lens cap) | 6.5 g (excluding lens cap) | |
| Power consumption | TBD | |
| Input voltage | DC5.0V | |
| Environmental regulations | RoHS2 compliant (TBC) | |
*1) The following three types of lenses are available.
| M8 | M12 | M12 | |
|---|---|---|---|
| Aperture/focal length | F2.6 2.8mm | F2.2 3.3mm | F2.8 1.8mm |
| Angle of view | H:110°/V:60°/D:141° | H:78.3°/V:48.8°/D:86.5° | H:116.8°/V:80.4°/D:125.8° |